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Nexperia has announced 20 bipolar power transistors in 2 x 2mm DFN2020D-3 packaging, half of them automotive-qualified. The span 50 and 80V ratings, 1 to 3A currents and both npn ... The post 3A bipolar transistors in 2x2mm DFN2020D-3 package appeared first on Electronics Weekly.

There is some hogwash out there, masquerading as engineering white papers, which are really just click bait to get your contact details. And there are some gems available for the ... The post Excellent ‘free’ book on bipolar transistors appeared first on Electronics Weekly.

Researchers from  Sandia National Laboratories of the US have used silicon photonics to perform the quantum sensing technique atom interferometry, an ultra-precise way of measuring acceleration, which could enable a kind ... The post Navigating without GPS appeared first on Electronics Weekly.

2024 smartphone shipments are forecast to grow 5.8% y-o-y to 1.23 billion units, according  IDC,  with 12% Q1 growth and 9% Q2 growth improving prospects  for H2. Premium markets are ... The post IDC expects 344% growth for GenAI smartphones in 2024 appeared first on Electronics Weekly.

Siemens Digital Industries Software has joined the Global Battery Alliance (GBA), a collaboration of international organisations, NGOs, industry actors, academics and governments to align collectively in a pre-competitive approach, to ... The post Siemens Digital joins battery initiative appeared first on Electronics Weekly.

The UK Space Agency (UKSA) has awarded £2.5 million to ten pilot projects as part of its Unlocking Space for Business programme. The projects will trial systems that use satellite ... The post UKSA funds 10 satellite data pilots for Unlocking Space for Business appeared first on Electronics Weekly.

Thanks to  Counterpoint Research for this one – the top seven semiconductor companies measured by market share based on revenue:   The post Top Ten (less 3) Semiconductor Companies In Q1 appeared first on Electronics Weekly.

Würth Elektronik has created a stick-back tape that blocks or absorbs electric and magnetic fields across 100Hz to 25GHz. Called WE-EMIP EMI absorber sheet, is only 72μm thick and consists ... The post Sticky-back EMI reduction patches appeared first on Electronics Weekly.

Crypto Quantique a provider of quantum-driven security for the IoT, has announced the development of a randomness test suite tailored specifically for Physical Unclonable Functions (PUFs). The suite, called TuRiNG, ... The post Open-Source randomness test suite for PUFs appeared first on Electronics Weekly.

Onsemi has announced a 112 x 62mm power module for flying capacitor boost converters up to 1kV. It combines 1kV silicon IGBTs and 1.2kV silicon carbide diodes in the company’s ... The post 112 x 62mm IGBT module for 1kV flying capacitor boost converters appeared first on Electronics Weekly.

Mastering AI is becoming increasingly vital. The post Strategies to Dominate the AI Accelerator Market appeared first on EE Times.

Beijing, China (August 27, 2024) —GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, and Power Management technologies, announces it has signed an Arm® Total Access (ATA) licensing agreement, laying the foundation for ongoing advancement in the design of embedded chips and the strategic expansion of its GD32 MCU product roadmap.  The post GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access appeared first on EE Times.

The South Korean startup unveils its tensor contraction processor concept at Hot Chips. The post Furiosa Targets LLM Inference With Second-Gen Chip appeared first on EE Times.

Recently, WeEn Semiconductors (hereafter referred to as WeEn), a globally leading international power device brand, participated in Electronica China 2024 in Shanghai. Under the theme ‘Energy Efficiency Driving Towards Zero Carbon’, WeEn showcased its innovative achievements in power semiconductor applications through diverse presentations. Furthermore, WeEn introduced its brand philosophy, ‘Power Efficiency for a Cooler Planet’, The post WeEn Semiconductors Unveils Diverse Achievements, Laying a New “Brand Foundation” appeared first on EE Times.

The U.K. IP provider has discontinued development of its AI accelerator and will focus on its edge GPU for AI going forward The post Imagination Raises $100 Million Investment To Take On Edge AI appeared first on EE Times.

In the fast-paced world of automotive development, high-performance data storage has become a crucial factor in advancing autonomous and electric vehicle technologies. dSPACE, a leader in simulation and validation tools for the automotive industry, recently faced this challenge when upgrading its AUTERA data logging system for advanced driver assistance systems (ADAS) and autonomous driving (AD) The post Exascend SSDs Accelerate ADAS Innovation at dSPACE  appeared first on EE Times.

EE Times’ 2024 Mind of the Engineer Survey is here and is open for you to provide your inputs until the second week of September 2024. The post The 2024 Mind of The Engineer Survey: Express Your Opinion appeared first on EE Times.

Introduction PFC converters are widely used in the industry to provide DC output voltage from the main lines, and to maintain a high power factor (PF) and low current distortion at the same time. In some of these applications, such as telecom, server, workstation power supplies, and plug-in electric vehicles, the active input power needs The post Feasibility and Accuracy Analysis of Input Power Estimation for Boost PFC Converters with Additional Sensors appeared first on EE Times.

AMD has taken another significant step towards providing full stack, vertically integrated AI system solutions. The post AMD Takes a Systems Approach to AI With ZT Acquisition appeared first on EE Times.

Tiny power-generation schemes may be technically legitimate but have very low power density and are often not scalable. The post Micro-Harvesting Will Not Power Our Planet appeared first on EE Times.

TI has been awarded $1.6 billion of Chips Act money and a loan of $3 billion and the right to a 25% tax credit on infrastucture investments to go towards ... The post TI gets $4.6bn in Chips Act funding appeared first on Electronics Weekly.

Chips Act investments to boost semiconductor manufacturing are not seeing the expected results, point out the New York Times, Wall Street Journal and FT. In May 2020 TSMC announced plans to ... The post Chips Act fab projects delayed appeared first on Electronics Weekly.

Q2 DRAM revenues were  up 24.8% q-o-q  at $22.9 billion, says TrendForce. Q2 contract prices were up 13%–18%. Samsung saw a 17%–19% ASP with bit shipments also rising leading to ... The post DRAM surging appeared first on Electronics Weekly.

SES Space & Defense has been awarded a U.S. Air Force (USAF) Air Combat Command (ACC) contract to help support the force’s airborne operations. The company will provide geostationary (GEO) ... The post SES GEO Ku-band satellites to support remotely piloted aircraft appeared first on Electronics Weekly.

Farnell is now shipping the new high-power SPDT (Single-Pole Double-Throw) RF antenna switch from Toshiba. The SPDT RF (TCWA1225G) switch is important for the expansion of 5G networks. This is ... The post Farnell shipping SPDT antenna switch from Toshiba appeared first on Electronics Weekly.

Having topped the medals table in London 2012, Rio 2016 and Tokyo 2020, the US continued to show its athletic superiority in Paris. China was the last country to break ... The post The Olympic Superpowers appeared first on Electronics Weekly.

Chip design is on a path toward proprietary, customized and differentiated domain-specific applications. The post On a Path Toward Domain-Specific Solutions appeared first on EE Times.

The WEAA honors companies and individuals who have made outstanding contributions to the electronics industry worldwide. The post Vote Now for the 2024 Global Electronics Awards appeared first on EE Times.

Microchip Technology has added the three more ICs to its TrustFlex secure key provisioning service. Secure key provisioning is putting secret information into ICs at a protected facility. Aimed at ... The post Microchip adds hardware to secure key provisioning service appeared first on Electronics Weekly.

94 years ago a company introduced this accessory for the motoring public which became ubiquitous. It brought fame and fortune to the company. Moral: A Great Pleasure Deserves A Great ... The post Fable: The Auto Accessory appeared first on Electronics Weekly.

Chemical-mechanical planarization has a profound impact on the economics of SiC production. The post Reducing Costs, Improving Efficiency in SiC Wafer Production with CMP appeared first on EE Times.

We're talking the new approach to EV production by the Japanese car industry, the new Raspberry Pi MCU, the RP2350, and what could be a landmark first use of AI in space for Earth Observation... The post What caught your eye this week? (EVs, RP2350, Space AI) appeared first on Electronics Weekly.

Richard LeCain has been appointed chief technology officer at the UK Battery Industrialisation Centre (UKBIC). “Richard has more than 20 years of experience working in the battery industry, having previously ... The post Richard LeCain becomes CTO of UK’s battery manufacturing centre of excellence appeared first on Electronics Weekly.

A leap forward in wireless tech is now being made by using satellite networks. The post Industry First Non-Terrestrial Network NB-IoT Testcase appeared first on EE Times.

The chip-design firm aims to supply chips made with Intel’s 18A process technology to the DoD. The post Draper Aims to Provide DoD Advanced Chips by 2027 appeared first on EE Times.

AMD's acquisition of Europe’s largest private AI lab highlights the company's goal to harness the full power of generative AI. The post Silo AI Acquisition Bolsters AMDs Software and Enterprise Strength appeared first on EE Times.

The chip industry can't just continue to scale by focusing on transistor poly pitch or gate oxide thickness. The post Intel 18A Advanced Packaging is Key to Tech Leadership appeared first on EE Times.

In this video interview, Jeff Wittich talks about the current challenges in the AI market. The post Talking AI Compute with Jeff Wittich in London appeared first on EE Times.

From automated guided vehicles (AGVs) and autonomous mobile robots (AMRs) to six-axis robots, robots are used to accomplish mechanical tasks with precision. Applications for these machines vary from military and industrial automation to consumer and medical. The permeation of AI made its way to robots rapidly, to train and automate this equipment for their respective The post Engineering Connector Considerations for Robotic Applications  appeared first on EE Times.

Mitsubishi Motors has  joined Nissan and Honda in an EV tie-upwhere all three companies share key components and software. Nissan and Honda announced an EV collaboration in March. Nissan CEO ... The post Mitsubishi joins Honda and Nissan in EV tie-up appeared first on Electronics Weekly.

SMIC, currently the world’s No.2 foundry, had Q2 profit which was down 59.1% y-o-y at $164.6 million on revenue up 21.8% at $1.9 billion.It forecast Q3 revenue growth of 13-15%. ... The post 59% Q2 profit drop at SMIC appeared first on Electronics Weekly.

TSMC had its best-ever revenue month in July – up 23.6% m-o-m and up 45% y-o-y at $7.9 billion with HPC contributing 52% of revenue. Revenue for January through July ... The post TSMC has best-ever revenue month appeared first on Electronics Weekly.

Ubotica, the space AI specialist, is highlighting what it describes as a significant milestone in Live Earth Intelligence for its CogniSAT-6 satellite mission. It is has achieved successful onboard AI ... The post CogniSAT-6 satellite mission achieves AI detection of Earth objects appeared first on Electronics Weekly.

Having managed to extricate myself from my unfortunate investments in AI ‘opportunities’, I am looking around for the next rope-a-dope ploy from the hype-monkeys, Ed confides to his diary. It ... The post Ed Gets Spaced Out appeared first on Electronics Weekly.

In choosing to put RISC-V cores on its new microcontroller – fear not, there are Arm Coretex-M33 cores too – Raspberry Pi will be helping put this architecture on the ... The post Raspberry Pi makes RISC-V more accessible appeared first on Electronics Weekly.

The value of the chip content in electronic systems will peak at 25%, TSMC’s US President, Ed Ross, told the 2003 Globalpress Summit Conference in Monterey. The silicon foundry industry ... The post Silicon Content Peaking At 25% appeared first on Electronics Weekly.

Raspberry Pi’s RP2030, its second-generation microcontroller, will be available by the end of the year in flash-less and flash-inclusive forms, in two packages: RP2350A QFN60 no flash $0.80 RP2350B QFN80 ... The post RP2350 available by year end, with flash-inclusive option appeared first on Electronics Weekly.

The semiconductor industry has integrated ever more functionality into smaller footprints and is starting to build upward. With the rise of three-dimensional integrated circuits (3D ICs), designers can pack more processing power and functionality into smaller spaces. However, this new dimension brings with it a host of challenges, including mechanical stresses and thermal effects, that The post The multiphysics challenges of 3D IC designs appeared first on EE Times.

Black Sesame International of Wuhan bombed on the Hong Kong stock exchange on Wednesday when its IPO – priced at HK$28 – saw its share price close at HK$20. Last ... The post Black Sesame bombs on HK exchange appeared first on Electronics Weekly.

Imec and ASML have patterned structures using High NA with the 0.55NA EUV scanner down to 9,5nm (19 nm pitch), random vias with 30nm center-to-center distance, 2D features at 22nm ... The post Imec and ASML pattern sub-20nm pitch metal layers in one exposure using High NA appeared first on Electronics Weekly.

Intel Foundry Services has a long road ahead before it can become a viable standalone business. The post Intel Years From Success in Foundry Business, Analysts Say appeared first on EE Times.

Automotive OEMs and suppliers are seeking new strategies to establish their role in software development. The post How New Technology Integration Revolutionizes Automobiles appeared first on EE Times.

Nisshinbo Micro Devices is working to strengthen its module business, which blends circuit, device, and packaging technology. Within this it is developing distinctive products using light sensor modules built around the optical semiconductors in which it has built a track record of high value-added products for more than forty years. Strengthening the module business as The post Actively investing to establish a third pillar of revenues alongside op-amps and power ICs appeared first on EE Times.

AI and GPUs are critical to enabling technologies like digital twins. The post SIGGRAPH 2024: Integrating Digital and Physical Worlds With GPUs and AI appeared first on EE Times.

What is Zero Trust?  Zero Trust redefines conventional cybersecurity tactics by adopting a “trust no one, verify everyone” stance. Rather than presuming a secure internal network, Zero Trust insists on stringent verification for every user and device seeking access to critical assets. The Zero Trust Framework broadens this stringent verification ethos throughout the organization, mandating The post Exploring the Impact of Trusted Time on Network Security appeared first on EE Times.

The U.S. AI chip startup will combine its chiplet with South Korea’s ABOV Semiconductor’s MCU chiplet. The post Femtosense Combines AI Chiplet with MCU for Audio SiP appeared first on EE Times.

It's clear automotive companies are all figuring out how to transition to software companies. The post The Path to SDVs: Just Deliver a Good Connected Vehicle Experience appeared first on EE Times.

Power management along with cooling solutions are especially critical for dissipating heat. The post AI Heats Up Data Center Cooling appeared first on EE Times.